HiCon is ready to help implement your 5G technology
-Application: 1150BGA
-Ball Pitch: 0.65mm
-Pin type: HB-Contact
-Application: 8892FBGA DIE
-Ball Pitch: 0.2mm
-Pin Type: HS-Contact
-Application: 1500BGA
-Ball Pitch: 0.6mm
-Pin Type: HB-Contact
-Application: 185BGA
-Ball Pitch: 0.4mm
-Pin Type: HSR-Contact